Professor

LU Yumin

Title: Professor
Subject: Microelectronics
Phone: +86-021-62511070
Fax: +86-021-62524192
Email: Yumin.Lu@sitrigroup.com
Address: 865 Changning Road, Shanghai, China

HONORS AND AWARDED RESEARCH FUNDS

The recruitment Program of Global Experts (Youth), 2014

NXP Talent Acceleration Program 2013

IET Institution of Engineering and TechnologyInternational Radar Conference, Technical Program Committee (TPC) member, 2013

NXP Peer Recognition Award 2012

Alpha Sigma Mu (Materials Science and Engineering Academic Honorary Society)

Finalist in Student Paper Competition, IEEE-MTT International Microwave Symposium, Long Beach, CA, 2005

Institute of Electrical and Electronics Engineers (IEEE), Senior Member;

M/A-COM Engineering Conference Committee Member, 2006-2008

M/A-COM Spot Bonus Award 2006

Reviewer for IEEE Transaction on Microwave Theory & Technique, IEEE Journal of Solid-State Circuits, and IEEE Microwave Wireless Components Letters

RESEARCH EXPERIENCE

Yumin Lu received the B.Sc. degree in materials science and engineering from Fudan University, Shanghai, China, in 1996, the M.Sc. degree in materials science and engineering from the Ohio State University, Columbus, in 2001, and the Ph.D. degree in electrical engineering from The University of Michigan at Ann Arbor, in 2005.

Dr. Lu is currently a professor at the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences. He also serves as SITRI’s VP of RF technology, focusing on development of high performance RF front end components and mmWave ICs. Before Joining SIMIT/SITRI, he has worked for NXP Semiconductors, Autoliv Electronics and M/A-COM Inc. in the US.

SELECTED PUBLICATIONS

1. “"Physical Models of Planar Spiral Inductor Integrated on The High-Resistivity and Trap-Rich Silicon-on-Insulator Substrates ", Accepted for publication on IEEE Transactions on Electron Devices, 2017

2. “RF Performance of Passive Components on State-of-Art Trap Rich Silicon-on-Insulator Substrate, 2016 International Symposium on VLSI Technology, Systems and Applications (2016 VLSI-TSA)

3. Yumin Lu, Ian Gresham, “Reducing VCO Sensitivity to Transient Load Pulling for 24GHz Applications,” Digest of M/A-COM Engineering Conference, 2008

4. Ian Gresham, Alan Jenkins, Noyan Kinayman, Rob Point, Yumin Lu, Ryosuke Ito and Andy Street; “Si Based UWB Radar Sensors,” Digest of IEEE Radar Conference, pp. 658-663, Apr 2007

5. Yumin Lu, Ian Gresham and Alan Jenkins, “A Closed-Loop Pulsed Power Control Circuit for UWB 24GHz Automotive Radar Transmitter,” Digest of IEEE MTT-S International Microwave Symposium, 2006

6. Ian Gresham, Noyan Kinayman, Alan Jenkins, Robert Point, Andy Street, Yumin Lu, Adil Khalil, Ryosuke Ito, and Richard Anderson, “A Fully Integrated 24GHz SiGe Receiver Chip in a Low-cost Micro-lead Plastic Package,” Digest of IEEE RFIC Symposium, 2006

7. Ian Gresham, Alan Jenkins, Noyan Kinayman, Rob Point, Yumin Lu, Ryosuke Ito, Andy Street, “Si Based UWB Radar Sensors –Design, Development, and Production,” Digest of The Institution of Engineering and Technology Seminar on mm-Wave Products and Technologies, pp. 27 – 32, Nov 2006

8. Yumin Lu, Linda Katehi and Dimitrios Peroulis, "High-Power MEMS Varactors and Impedance Tuners for Millimeter-Wave Applications,” IEEE Transactions on Microwave Theory and Techniques, vol. 53, pp. 3672-3678, Nov 2005

9. Yumin Lu, Linda P. B. Katehi and Dimitrios Peroulis, “A Novel MEMS Impedance Tuner Simultaneously Optimized for Maximum Impedance Range And Power Handling,” Digest of IEEE MTT-S International Microwave Symposium, 2005

10. Dimitrios Peroulis, Yumin Lu and Linda P.B. Katehi, “Packaging Technology for RF MEMS Switches,” Digest of the 30th Annual GOMACTech Conference, Las Vegas, NV, April 2005

11. Dimitrios Peroulis, Yumin Lu and Linda Katehi, “Highly Reliable Analog MEMS Varactors,” IEEE MTT-S International Microwave Symposium Digest, pp. 869-872, June 2004

Yumin Lu, Dimitrios Peroulis, Saeed Mohammadi, and Linda Katehi, "A MEMS Reconfigurable Matching Network for a Class AB Amplifier,” IEEE Microwave Wireless Components Letters, vol. 13, pp. 437-439, Oct 2003

INVITED TALKS