1. Home > Research > Patents
Patents
COPPER INTERCONNECTION STRUCTURE WITH MIM CAPACITOR AND A MANUFACTURING METHOD THEREOF
Name: COPPER INTERCONNECTION STRUCTURE WITH MIM CAPACITOR AND A MANUFACTURING METHOD THEREOF
The patent category:
Application number: 12937264
Application date: 2010/7/14
First inventor: XIAO, Deyuan
Other inventors: HUANG, Xiaolu
Other note:

Copyright © Shanghai Institute of Microsystem And Information Technology
ADD：865 Changning Road, Shanghai 200050, China  TEL：86-21-62511070  FAX：86-21-62513510